| CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
| Memory corruption in Core Services while executing the command for removing a single event listener. |
| Transient DOS may occur when processing vendor-specific information elements while parsing a WLAN frame for BTM requests. |
| Transient DOS in Multi-Mode Call Processor due to UE failure because of heap leakage. |
| Memory corruption when HLOS allocates the response payload buffer to copy the data received from ADSP in response to AVCS_LOAD_MODULE command. |
| Transient DOS may occur while processing the country IE. |
| Memory corruption while copying a keyblob`s material when the key material`s size is not accurately checked. |
| Memory corruption when BTFM client sends new messages over Slimbus to ADSP. |
| Memory corruption while processing Listen Sound Model client payload buffer when there is a request for Listen Sound session get parameter from ST HAL. |
| Memory corruption when two threads try to map and unmap a single node simultaneously. |
| Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame. |
| Information Disclosure in data Modem while parsing an FMTP line in an SDP message. |
| Memory corruption when preparing a shared memory notification for a memparcel in Resource Manager. |
| Memory Corruption in WLAN HOST while parsing QMI response message from firmware. |
| Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. |
| Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. |
| Memory corruption in HLOS while running playready use-case. |
| Transient DOS in Data Modem during DTLS handshake. |
| Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption due to use after free issue in kernel while processing ION handles in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |
| Memory corruption in Audio during playback with speaker protection. |