CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
Transient DOS while parsing WPA IES, when it is passed with length more than expected size. |
Memory corruption in HLOS while checking for the storage type. |
Memory corruption in DSP Service during a remote call from HLOS to DSP. |
Memory corruption while using the UIM diag command to get the operators name. |
Possible use after free due to improper handling of memory mapping of multiple processes simultaneously. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |
Improper handling of address deregistration on failure can lead to new GPU address allocation failure. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |
Memory corruption due to improper check to return error when user application requests memory allocation of a huge size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |
Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music |
Memory corruption while copying the result to the transmission queue which is shared between the virtual machine and the host. |
Memory corruption while copying the result to the transmission queue in EMAC. |
Transient DOS while processing 11AZ RTT management action frame received through OTA. |
Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. |
Cryptographic issue in Automotive while unwrapping the key secs2d and verifying with RPMB data. |
Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. |
Information disclosure in Core services while processing a Diag command. |
Memory corruption in HLOS while running playready use-case. |
Transient DOS in Data Modem during DTLS handshake. |
Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
Memory corruption due to use after free issue in kernel while processing ION handles in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |
Memory corruption in Audio during playback with speaker protection. |