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Search Results (422 CVEs found)

CVE Vendors Products Updated CVSS v3.1
CVE-2017-18172 1 Qualcomm 48 Mdm9635m, Mdm9635m Firmware, Sd 400 and 45 more 2024-11-21 N/A
In a device, with screen size 1440x2560, the check of contiguous buffer will overflow on certain buffer size resulting in an Integer Overflow or Wraparound in System UI in Snapdragon Automobile, Snapdragon Mobile in version MDM9635M, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.
CVE-2017-18171 1 Qualcomm 50 Qca9379, Qca9379 Firmware, Sd 205 and 47 more 2024-11-21 N/A
Improper input validation for GATT data packet received in Bluetooth Controller function can lead to possible memory corruption in Snapdragon Mobile in version QCA9379, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, SD 850, SDM630, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016.
CVE-2017-18170 1 Qualcomm 50 Qca9379, Qca9379 Firmware, Sd 205 and 47 more 2024-11-21 N/A
Improper input validation in Bluetooth Controller function can lead to possible memory corruption in Snapdragon Mobile in version QCA9379, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, SD 850, SDM630, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016.
CVE-2017-18157 1 Qualcomm 42 Mdm9206, Mdm9206 Firmware, Mdm9607 and 39 more 2024-11-21 N/A
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
CVE-2017-18156 1 Qualcomm 24 Mdm9206, Mdm9206 Firmware, Mdm9607 and 21 more 2024-11-21 N/A
While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20.
CVE-2017-18155 1 Qualcomm 12 Msm8996au, Msm8996au Firmware, Sd 450 and 9 more 2024-11-21 N/A
While playing HEVC content using HD DMB in Snapdragon Automobile and Snapdragon Mobile in version MSM8996AU, SD 450, SD 625, SD 820, SD 820A, SD 835, an uninitialized variable can be used leading to a kernel fault.
CVE-2017-18146 1 Qualcomm 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, in some corner cases, ECDSA signature verification can fail.
CVE-2017-18145 1 Qualcomm 28 Msm8909w, Msm8909w Firmware, Sd 205 and 25 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while the DPM native process is processing framework events, the iterator pointer is deleted after processing an event. When processing subsequent events, a Use After Condition will occur.
CVE-2017-18144 1 Qualcomm 28 Msm8909w, Msm8909w Firmware, Sd 205 and 25 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while processing the retransmission of WPA supplicant command send failures, there is a make after break of the connection to WPA supplicant where the local pointer is not properly updated. If the WPA supplicant command transmission fails, a Use After Free condition will occur.
CVE-2017-18141 1 Qualcomm 68 Ipq8074, Ipq8074 Firmware, Mdm9206 and 65 more 2024-11-21 N/A
When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016.
CVE-2017-18140 1 Qualcomm 48 Mdm9206, Mdm9206 Firmware, Mdm9607 and 45 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. If eMBMS service is enabled while processing the call disconnect, a Use After Free condition may potentially occur.
CVE-2017-18139 1 Qualcomm 60 Mdm9206, Mdm9206 Firmware, Mdm9607 and 57 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, a buffer overflow vulnerability may potentially exist while making an IMS call.
CVE-2017-18138 1 Qualcomm 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, in GERAN, a buffer overflow may potentially occur.
CVE-2017-18137 1 Qualcomm 22 Mdm9640, Mdm9640 Firmware, Mdm9645 and 19 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile MDM9640, MDM9645, MDM9650, MDM9655, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 835, while processing the IPv6 pdp address of the pdp context, a buffer overflow can occur.
CVE-2017-18136 1 Qualcomm 52 Mdm9206, Mdm9206 Firmware, Mdm9607 and 49 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 820, SD 820A, SD 835, SD 845, in the omx aac component, a Use After Free condition may potentially occur.
CVE-2017-18131 1 Qualcomm 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more 2024-11-21 N/A
In QTEE, an incorrect fuse value can be blown in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 820, SD 820A, SD 835, SD 845, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016.
CVE-2017-18130 1 Qualcomm 44 Mdm9206, Mdm9206 Firmware, Mdm9607 and 41 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 820, SD 820A, SD 835, SD 845, while playing an ASF file, a buffer over-read can potentially occur.
CVE-2017-18127 1 Qualcomm 24 Msm8909w, Msm8909w Firmware, Sd 205 and 21 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 835, SD 845, while processing a SetParam command packet in the VR service, the extracted name_len and value_len values are not checked and could potentially cause a buffer overflow in subsequent calls to memcpy().
CVE-2017-18126 1 Qualcomm 70 Mdm9206, Mdm9206 Firmware, Mdm9607 and 67 more 2024-11-21 N/A
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9640, MDM9650, QCA6174A, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA9377, QCA9379, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016, the original mac spoofing feature does not use the following in probe request frames: (a) randomized sequence numbers and (b) randomized source address for cfg80211 scan, vendor scan and pno scan which may affect user privacy.
CVE-2017-18124 1 Qualcomm 72 Fsm9055, Fsm9055 Firmware, Ipq4019 and 69 more 2024-11-21 N/A
During secure boot, addition is performed on uint8 ptrs which led to overflow issue in Small Cell SoC, Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version FSM9055, IPQ4019, MDM9206, MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDX20