Memory corruption during management frame processing due to mismatch in T2LM info element.
Information disclosure while handling T2LM Action Frame in WLAN Host.
Transient DOS may occur when processing vendor-specific information elements while parsing a WLAN frame for BTM requests.
Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame.
Transient DOS when processing a NULL buffer while parsing WLAN vdev.
Memory Corruption in Data Modem while processing DMA buffer release event about CFR data.
Memory corruption while processing manipulated payload in video firmware.
Arbitrary memory overwrite when VM gets compromised in TX write leading to Memory Corruption.
Transient DOS while key unwrapping process, when the given encrypted key is empty or NULL.
Transient DOS in WLAN Firmware while parsing a BTM request.
Transient DOS can occur when the driver parses the per STA profile IE and tries to access the EXTN element ID without checking the IE length.
Information disclosure while parsing the BSS parameter change count or MLD capabilities fields of the ML IE.
Information disclosure in WLAN HAL while handling command through WMI interfaces.
Transient DOS while parsing the multi-link element Control field when common information length check is missing before updating the location.
Memory corruption when processing cmd parameters while parsing vdev.
Transient DOS in WLAN Firmware while parsing a NAN management frame.
Transient DOS while processing 11AZ RTT management action frame received through OTA.
Transient DOS while parsing ieee80211_parse_mscs_ie in WIN WLAN driver.
Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking