| CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
| Information Disclosure in Qualcomm IPC while reading values from shared memory in VM. |
| Memory corruption in WLAN Firmware while doing a memory copy of pmk cache. |
| Memory Corruption in WLAN HOST while parsing QMI response message from firmware. |
| Transient DOS while parsing the received TID-to-link mapping element of beacon/probe response frame. |
| Memory Corruption in WLAN HOST while processing WLAN FW request to allocate memory. |
| Transient DOS while parsing WPA IES, when it is passed with length more than expected size. |
| Transient DOS may occur when processing vendor-specific information elements while parsing a WLAN frame for BTM requests. |
| Transient DOS in WLAN Firmware while parsing a NAN management frame. |
| Transient DOS while parsing MBSSID during new IE generation in beacon/probe frame when IE length check is either missing or improper. |
| Information disclosure in IOE Firmware while handling WMI command. |
| Memory corruption in MPP performance while accessing DSM watermark using external memory address. |
| Information disclosure in WLAN HAL while handling command through WMI interfaces. |
| Transient DOS while key unwrapping process, when the given encrypted key is empty or NULL. |
| Transient DOS while parsing noninheritance IE of Extension element when length of IE is 2 of beacon frame. |
| Transient DOS while parse fils IE with length equal to 1. |
| Arbitrary memory overwrite when VM gets compromised in TX write leading to Memory Corruption. |
| Information disclosure while handling T2LM Action Frame in WLAN Host. |
| Transient DOS while processing 11AZ RTT management action frame received through OTA. |
| Transient DOS while parsing ieee80211_parse_mscs_ie in WIN WLAN driver. |
| Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
