Filtered by vendor Qualcomm
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Total
2138 CVE
| CVE | Vendors | Products | Updated | CVSS v3.1 |
|---|---|---|---|---|
| CVE-2017-18155 | 1 Qualcomm | 12 Msm8996au, Msm8996au Firmware, Sd 450 and 9 more | 2024-11-21 | N/A |
| While playing HEVC content using HD DMB in Snapdragon Automobile and Snapdragon Mobile in version MSM8996AU, SD 450, SD 625, SD 820, SD 820A, SD 835, an uninitialized variable can be used leading to a kernel fault. | ||||
| CVE-2017-18146 | 1 Qualcomm | 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more | 2024-11-21 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, in some corner cases, ECDSA signature verification can fail. | ||||
| CVE-2017-18145 | 1 Qualcomm | 28 Msm8909w, Msm8909w Firmware, Sd 205 and 25 more | 2024-11-21 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while the DPM native process is processing framework events, the iterator pointer is deleted after processing an event. When processing subsequent events, a Use After Condition will occur. | ||||
| CVE-2017-18144 | 1 Qualcomm | 28 Msm8909w, Msm8909w Firmware, Sd 205 and 25 more | 2024-11-21 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while processing the retransmission of WPA supplicant command send failures, there is a make after break of the connection to WPA supplicant where the local pointer is not properly updated. If the WPA supplicant command transmission fails, a Use After Free condition will occur. | ||||
| CVE-2017-18143 | 1 Qualcomm | 4 Sd 845, Sd 845 Firmware, Sd 850 and 1 more | 2024-11-21 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile SD 845, SD 850, on a secure device, PD dumps are collected when debugging is not enabled. | ||||
| CVE-2017-18142 | 1 Qualcomm | 10 Mdm9650, Mdm9650 Firmware, Mdm9655 and 7 more | 2024-11-21 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile MDM9650, MDM9655, SD 835, SD 845, SD 850, while processing the IMS SIP username, a buffer overflow can occur. | ||||
| CVE-2017-18141 | 1 Qualcomm | 68 Ipq8074, Ipq8074 Firmware, Mdm9206 and 65 more | 2024-11-21 | N/A |
| When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. | ||||
| CVE-2017-18140 | 1 Qualcomm | 48 Mdm9206, Mdm9206 Firmware, Mdm9607 and 45 more | 2024-11-21 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. If eMBMS service is enabled while processing the call disconnect, a Use After Free condition may potentially occur. | ||||
| CVE-2017-18139 | 1 Qualcomm | 60 Mdm9206, Mdm9206 Firmware, Mdm9607 and 57 more | 2024-11-21 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, a buffer overflow vulnerability may potentially exist while making an IMS call. | ||||
| CVE-2017-18138 | 1 Qualcomm | 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more | 2024-11-21 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, in GERAN, a buffer overflow may potentially occur. | ||||
| CVE-2017-18137 | 1 Qualcomm | 22 Mdm9640, Mdm9640 Firmware, Mdm9645 and 19 more | 2024-11-21 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile MDM9640, MDM9645, MDM9650, MDM9655, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 835, while processing the IPv6 pdp address of the pdp context, a buffer overflow can occur. | ||||
| CVE-2017-18136 | 1 Qualcomm | 52 Mdm9206, Mdm9206 Firmware, Mdm9607 and 49 more | 2024-11-21 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 820, SD 820A, SD 835, SD 845, in the omx aac component, a Use After Free condition may potentially occur. | ||||
| CVE-2017-18135 | 1 Qualcomm | 18 Mdm9650, Mdm9650 Firmware, Mdm9655 and 15 more | 2024-11-21 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile MDM9650, MDM9655, SD 450, SD 625, SD 650/52, SD 835, SD 845, SD 850, in the Wireless Data Service (WDS) module, a buffer overflow can occur. | ||||
| CVE-2017-18134 | 1 Qualcomm | 4 Sd 845, Sd 845 Firmware, Sd 850 and 1 more | 2024-11-21 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile SD 845, SD 850, a buffer overflow may potentially occur while processing a response from the SIM card. | ||||
| CVE-2017-18133 | 1 Qualcomm | 14 Mdm9206, Mdm9206 Firmware, Mdm9607 and 11 more | 2024-11-21 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, an out of bound access for ebi channel array can potentially occur. | ||||
| CVE-2017-18132 | 1 Qualcomm | 6 Mdm9206, Mdm9206 Firmware, Mdm9607 and 3 more | 2024-11-21 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile and Snapdragon Mobile MDM9206, MDM9607, MDM8996, an out-of-bounds access can potentially occur in tz_assign(). | ||||
| CVE-2017-18131 | 1 Qualcomm | 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more | 2024-11-21 | N/A |
| In QTEE, an incorrect fuse value can be blown in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 820, SD 820A, SD 835, SD 845, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016. | ||||
| CVE-2017-18130 | 1 Qualcomm | 44 Mdm9206, Mdm9206 Firmware, Mdm9607 and 41 more | 2024-11-21 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 820, SD 820A, SD 835, SD 845, while playing an ASF file, a buffer over-read can potentially occur. | ||||
| CVE-2017-18129 | 1 Qualcomm | 10 Mdm9206, Mdm9206 Firmware, Mdm9607 and 7 more | 2024-11-21 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile and Snapdragon Mobile MDM9206, MDM9607, SD 845, MSM8996, MSM8998, it is possible for IPA (internet protocol accelerator) channels owned by one security domain to be controlled from other domains. | ||||
| CVE-2017-18128 | 1 Qualcomm | 4 Sd 845, Sd 845 Firmware, Sd 850 and 1 more | 2024-11-21 | N/A |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile SD 845, SD 850, improper access control while configuring MPU protecting error correction registers may potentially lead to exposure of related secured data. | ||||