Filtered by vendor Qualcomm
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Filtered by product Sd810
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Total
7 CVE
CVE | Vendors | Products | Updated | CVSS v3.1 |
---|---|---|---|---|
CVE-2017-18314 | 1 Qualcomm | 74 Mdm9206, Mdm9206 Firmware, Mdm9607 and 71 more | 2024-08-05 | N/A |
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ. | ||||
CVE-2018-11982 | 1 Qualcomm | 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more | 2024-08-05 | N/A |
In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure. | ||||
CVE-2018-11277 | 1 Qualcomm | 40 Msm8909w, Msm8909w Firmware, Msm8996au and 37 more | 2024-08-05 | N/A |
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue. | ||||
CVE-2018-11269 | 1 Qualcomm | 70 Mdm9206, Mdm9206 Firmware, Mdm9607 and 67 more | 2024-08-05 | N/A |
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options. | ||||
CVE-2018-11268 | 1 Qualcomm | 70 Mdm9206, Mdm9206 Firmware, Mdm9607 and 67 more | 2024-08-05 | N/A |
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options. | ||||
CVE-2018-11285 | 1 Qualcomm | 64 Mdm9206, Mdm9206 Firmware, Mdm9607 and 61 more | 2024-08-05 | N/A |
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, while parsing FLAC file with corrupted picture block, a buffer over-read can occur. | ||||
CVE-2018-11291 | 1 Qualcomm | 72 Ipq8074, Ipq8074 Firmware, Mdm9206 and 69 more | 2024-08-05 | N/A |
In Snapdragon (Automobile, Mobile, Wear) in version IPQ8074, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA4531, QCA6174A, QCA6564, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA9377, QCA9378, QCA9379, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, cryptographic issues due to the random number generator was not a strong one in NAN. |
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