CVE-2021-37376 - Vulnerability Details - OpenCVE

Cross Site Scripting (XSS) vulnerability in Teradek Bond, Bond 2 and Bond Pro firmware version 7.3.x and earlier allows remote attackers to run arbitrary code via the Friendly Name field in System Information Settings. NOTE: Vedor states the product has reached End of Life and will not be receiving any firmware updates to address this issue.

No CVSS v4.0

Attack Vector Network

Attack Complexity Low

Privileges Required Low

Scope Changed

Confidentiality Impact Low

Integrity Impact Low

Availability Impact None

User Interaction Required

No CVSS v3.0

No CVSS v2

This CVE is not in the KEV list.

The EPSS score is 0.00134.

Key SSVC decision points have not yet been added.

Vendors	Products
Teradek	Bond Bond 2 Bond 2 Firmware Bond Firmware Bond Pro Bond Pro Firmware

Configuration 1 [-]

AND

cpe:2.3:o:teradek:bond_firmware:*:*:*:*:*:*:*:*

cpe:2.3:h:teradek:bond:-:*:*:*:*:*:*:*

Configuration 2 [-]

AND

cpe:2.3:o:teradek:bond_2_firmware:*:*:*:*:*:*:*:*

cpe:2.3:h:teradek:bond_2:-:*:*:*:*:*:*:*

Configuration 3 [-]

AND

cpe:2.3:o:teradek:bond_pro_firmware:*:*:*:*:*:*:*:*

cpe:2.3:h:teradek:bond_pro:-:*:*:*:*:*:*:*

No data.

No data.

Fixes

Solution

No solution given by the vendor.

Workaround

No workaround given by the vendor.

References

Link	Providers
https://tbutler.org/2021/04/29/teradek-vulnerability-advisory
https://teradek.com/collections/cube2

History

No history.

MITRE

Status: PUBLISHED

Assigner: mitre

Published: 2023-02-03T00:00:00

Updated: 2024-08-04T01:16:03.790Z

Reserved: 2021-07-21T00:00:00

Link: CVE-2021-37376

Vulnrichment

Updated: 2024-08-04T01:16:03.790Z

NVD

Status : Modified

Published: 2023-02-03T18:15:12.977

Modified: 2024-11-21T06:15:02.380

Link: CVE-2021-37376

Redhat

No data.

OpenCVE Enrichment

No data.

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