While sending the response to a RIL_REQUEST_GET_SMSC_ADDRESS message, a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear.
Project Subscriptions
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|---|---|
|
Qualcomm
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Mdm9206
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Advisories
| Source | ID | Title |
|---|---|---|
EUVD |
EUVD-2018-17645 | While sending the response to a RIL_REQUEST_GET_SMSC_ADDRESS message, a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear. |
Fixes
Solution
No solution given by the vendor.
Workaround
No workaround given by the vendor.
References
| Link | Providers |
|---|---|
| https://www.qualcomm.com/company/product-security/bulletins |
|
History
No history.
Projects
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Status: PUBLISHED
Assigner: qualcomm
Published:
Updated: 2024-09-16T22:26:36.805Z
Reserved: 2018-01-19T00:00:00
Link: CVE-2018-5878
No data.
Status : Modified
Published: 2018-07-06T17:29:01.710
Modified: 2024-11-21T04:09:37.333
Link: CVE-2018-5878
No data.
OpenCVE Enrichment
No data.
Weaknesses
EUVD