Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130
History

No history.

cve-icon MITRE

Status: PUBLISHED

Assigner: qualcomm

Published: 2020-07-30T11:40:27

Updated: 2024-08-05T00:05:44.332Z

Reserved: 2019-07-19T00:00:00

Link: CVE-2019-14037

cve-icon Vulnrichment

No data.

cve-icon NVD

Status : Analyzed

Published: 2020-07-30T12:15:11.333

Modified: 2020-07-31T13:55:19.537

Link: CVE-2019-14037

cve-icon Redhat

No data.