Out of bound write in DSP service due to improper bound check for response buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Advisories
Source ID Title
EUVD EUVD EUVD-2021-21776 Out of bound write in DSP service due to improper bound check for response buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Fixes

Solution

No solution given by the vendor.


Workaround

No workaround given by the vendor.

History

No history.

cve-icon MITRE

Status: PUBLISHED

Assigner: qualcomm

Published:

Updated: 2024-08-04T00:33:51.259Z

Reserved: 2021-06-21T00:00:00

Link: CVE-2021-35132

cve-icon Vulnrichment

No data.

cve-icon NVD

Status : Modified

Published: 2022-09-02T12:15:09.113

Modified: 2024-11-21T06:11:59.993

Link: CVE-2021-35132

cve-icon Redhat

No data.

cve-icon OpenCVE Enrichment

No data.