OpenCVE

Memory corruption in Qualcomm IPC due to use after free while receiving the incoming packet and reposting it.

No CVSS v4.0

Attack Vector Local

Attack Complexity Low

Privileges Required Low

Scope Unchanged

Confidentiality Impact High

Integrity Impact High

Availability Impact High

User Interaction None

No CVSS v3.0

No CVSS v2

This CVE is not in the KEV list.

Key SSVC decision points have not yet been added.

Vendors	Products
Qualcomm	Sg4150p Sg4150p Firmware Sm6225 Sm6225-ad Sm6225-ad Firmware Sm6225 Firmware Wcd9370 Wcd9370 Firmware Wcd9375 Wcd9375 Firmware Wcn3950 Wcn3950 Firmware Wcn3988 Wcn3988 Firmware Wsa8810 Wsa8810 Firmware

Configuration 1 [-]

AND

cpe:2.3:o:qualcomm:sg4150p_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sg4150p:-:*:*:*:*:*:*:*

Configuration 2 [-]

AND

cpe:2.3:o:qualcomm:sm6225_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sm6225:-:*:*:*:*:*:*:*

Configuration 3 [-]

AND

cpe:2.3:o:qualcomm:sm6225-ad_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:sm6225-ad:-:*:*:*:*:*:*:*

Configuration 4 [-]

AND

cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:wcd9370:-:*:*:*:*:*:*:*

Configuration 5 [-]

AND

cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:wcd9375:-:*:*:*:*:*:*:*

Configuration 6 [-]

AND

cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:wcn3950:-:*:*:*:*:*:*:*

Configuration 7 [-]

AND

cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:wcn3988:-:*:*:*:*:*:*:*

Configuration 8 [-]

AND

cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:wsa8810:-:*:*:*:*:*:*:*

No data.

References

Link	Providers
https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin

History

No history.

MITRE

Status: PUBLISHED

Assigner: qualcomm

Published: 2023-05-02T05:08:45.337Z

Updated: 2024-08-03T08:01:20.553Z

Reserved: 2022-06-14T10:44:39.610Z

Link: CVE-2022-33292

Vulnrichment

No data.

NVD

Status : Modified

Published: 2023-05-02T06:15:09.757

Modified: 2024-11-21T07:08:05.440

Link: CVE-2022-33292

Redhat

No data.

{"dataType": "CVE_RECORD", "dataVersion": "5.1", "cveMetadata": {"cveId": "CVE-2022-33292", "assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f", "state": "PUBLISHED", "assignerShortName": "qualcomm", "dateReserved": "2022-06-14T10:44:39.610Z", "datePublished": "2023-05-02T05:08:45.337Z", "dateUpdated": "2024-08-03T08:01:20.553Z"}, "containers": {"cna": {"affected": [{"defaultStatus": "unaffected", "platforms": ["Snapdragon Compute", "Snapdragon Mobile"], "product": "Snapdragon", "vendor": "Qualcomm, Inc.", "versions": [{"status": "affected", "version": "SG4150P"}, {"status": "affected", "version": "Snapdragon 680 4G Mobile Platform"}, {"status": "affected", "version": "Snapdragon 685 4G Mobile Platform (SM6225-AD)"}, {"status": "affected", "version": "WCD9370"}, {"status": "affected", "version": "WCD9375"}, {"status": "affected", "version": "WCN3950"}, {"status": "affected", "version": "WCN3988"}, {"status": "affected", "version": "WSA8810"}]}], "descriptions": [{"lang": "en", "value": "Memory corruption in Qualcomm IPC due to use after free while receiving the incoming packet and reposting it."}], "metrics": [{"cvssV3_1": {"attackComplexity": "LOW", "attackVector": "LOCAL", "availabilityImpact": "HIGH", "baseScore": 7.8, "baseSeverity": "HIGH", "confidentialityImpact": "HIGH", "integrityImpact": "HIGH", "privilegesRequired": "LOW", "scope": "UNCHANGED", "userInteraction": "NONE", "vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H", "version": "3.1"}, "format": "CVSS", "scenarios": [{"lang": "en", "value": "GENERAL"}]}], "providerMetadata": {"orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f", "shortName": "qualcomm", "dateUpdated": "2024-04-12T16:27:33.874Z"}, "references": [{"url": "https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin"}], "title": "Use after free in Qualcomm IPC", "problemTypes": [{"descriptions": [{"cweId": "CWE-416", "description": "CWE-416 Use After Free", "lang": "en", "type": "CWE"}]}]}, "adp": [{"providerMetadata": {"orgId": "af854a3a-2127-422b-91ae-364da2661108", "shortName": "CVE", "dateUpdated": "2024-08-03T08:01:20.553Z"}, "title": "CVE Program Container", "references": [{"url": "https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin", "tags": ["x_transferred"]}]}]}}

{"configurations": [{"nodes": [{"cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:sg4150p_firmware:-:*:*:*:*:*:*:*", "matchCriteriaId": "9279F02F-6C30-4891-8941-97003DE9C8C7", "vulnerable": true}], "negate": false, "operator": "OR"}, {"cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:sg4150p:-:*:*:*:*:*:*:*", "matchCriteriaId": "FFA7BB42-305C-451F-92D8-0718DF68A012", "vulnerable": false}], "negate": false, "operator": "OR"}], "operator": "AND"}, {"nodes": [{"cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:sm6225_firmware:-:*:*:*:*:*:*:*", "matchCriteriaId": "EC2668D5-623D-4E13-AF37-6F7040A14007", "vulnerable": true}], "negate": false, "operator": "OR"}, {"cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:sm6225:-:*:*:*:*:*:*:*", "matchCriteriaId": "72B0F4C7-CA0F-4B9C-A6AA-60934B2AB2C2", "vulnerable": false}], "negate": false, "operator": "OR"}], "operator": "AND"}, {"nodes": [{"cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:sm6225-ad_firmware:-:*:*:*:*:*:*:*", "matchCriteriaId": "E089DC83-3849-4671-95B9-E4C958EC79FB", "vulnerable": true}], "negate": false, "operator": "OR"}, {"cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:sm6225-ad:-:*:*:*:*:*:*:*", "matchCriteriaId": "E38F8F04-F841-492B-A555-96DBD7461380", "vulnerable": false}], "negate": false, "operator": "OR"}], "operator": "AND"}, {"nodes": [{"cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:*", "matchCriteriaId": "1295D869-F4DD-4766-B4AA-3513752F43B4", "vulnerable": true}], "negate": false, "operator": "OR"}, {"cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:wcd9370:-:*:*:*:*:*:*:*", "matchCriteriaId": "B98784DC-3143-4D38-AD28-DBBDCCAB4272", "vulnerable": false}], "negate": false, "operator": "OR"}], "operator": "AND"}, {"nodes": [{"cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:*", "matchCriteriaId": "34143ABA-7D09-429F-A65C-3A33438BF62C", "vulnerable": true}], "negate": false, "operator": "OR"}, {"cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:wcd9375:-:*:*:*:*:*:*:*", "matchCriteriaId": "9D56DFE3-5EF1-4B23-BBD5-0203FBF9CCEC", "vulnerable": false}], "negate": false, "operator": "OR"}], "operator": "AND"}, {"nodes": [{"cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:*", "matchCriteriaId": "3FEF2DB6-00F5-4B07-953B-EF58B31267F1", "vulnerable": true}], "negate": false, "operator": "OR"}, {"cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:wcn3950:-:*:*:*:*:*:*:*", "matchCriteriaId": "120E8F0F-EBEB-4565-9927-2D473F783EF7", "vulnerable": false}], "negate": false, "operator": "OR"}], "operator": "AND"}, {"nodes": [{"cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:*", "matchCriteriaId": "E4BFB25F-013B-48E3-99FF-3E8687F94423", "vulnerable": true}], "negate": false, "operator": "OR"}, {"cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:wcn3988:-:*:*:*:*:*:*:*", "matchCriteriaId": "BF676C5B-838B-446C-A689-6A25AB8A87E2", "vulnerable": false}], "negate": false, "operator": "OR"}], "operator": "AND"}, {"nodes": [{"cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:wsa8810_firmware:-:*:*:*:*:*:*:*", "matchCriteriaId": "15307882-7039-43E9-9BA3-035045988B99", "vulnerable": true}], "negate": false, "operator": "OR"}, {"cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:wsa8810:-:*:*:*:*:*:*:*", "matchCriteriaId": "AA85B322-E593-4499-829A-CC6D70BAE884", "vulnerable": false}], "negate": false, "operator": "OR"}], "operator": "AND"}], "descriptions": [{"lang": "en", "value": "Memory corruption in Qualcomm IPC due to use after free while receiving the incoming packet and reposting it."}], "id": "CVE-2022-33292", "lastModified": "2024-11-21T07:08:05.440", "metrics": {"cvssMetricV31": [{"cvssData": {"attackComplexity": "LOW", "attackVector": "LOCAL", "availabilityImpact": "HIGH", "baseScore": 7.8, "baseSeverity": "HIGH", "confidentialityImpact": "HIGH", "integrityImpact": "HIGH", "privilegesRequired": "LOW", "scope": "UNCHANGED", "userInteraction": "NONE", "vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H", "version": "3.1"}, "exploitabilityScore": 1.8, "impactScore": 5.9, "source": "product-security@qualcomm.com", "type": "Secondary"}, {"cvssData": {"attackComplexity": "LOW", "attackVector": "LOCAL", "availabilityImpact": "HIGH", "baseScore": 7.8, "baseSeverity": "HIGH", "confidentialityImpact": "HIGH", "integrityImpact": "HIGH", "privilegesRequired": "LOW", "scope": "UNCHANGED", "userInteraction": "NONE", "vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H", "version": "3.1"}, "exploitabilityScore": 1.8, "impactScore": 5.9, "source": "nvd@nist.gov", "type": "Primary"}]}, "published": "2023-05-02T06:15:09.757", "references": [{"source": "product-security@qualcomm.com", "tags": ["Patch", "Vendor Advisory"], "url": "https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin"}, {"source": "af854a3a-2127-422b-91ae-364da2661108", "tags": ["Patch", "Vendor Advisory"], "url": "https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin"}], "sourceIdentifier": "product-security@qualcomm.com", "vulnStatus": "Modified", "weaknesses": [{"description": [{"lang": "en", "value": "CWE-416"}], "source": "product-security@qualcomm.com", "type": "Secondary"}, {"description": [{"lang": "en", "value": "CWE-416"}], "source": "nvd@nist.gov", "type": "Primary"}]}