CVE-2023-28561 - Vulnerability Details - OpenCVE

Memory corruption in QESL while processing payload from external ESL device to firmware.

No CVSS v4.0

Attack Vector Network

Attack Complexity Low

Privileges Required None

Scope Unchanged

Confidentiality Impact High

Integrity Impact High

Availability Impact High

User Interaction None

No CVSS v3.0

No CVSS v2

This CVE is not in the KEV list.

The EPSS score is 0.00144.

Exploitation none

Automatable no

Technical Impact total

Vendors	Products
Qualcomm	Qcn7606 Qcn7606 Firmware

Configuration 1 [-]

AND

cpe:2.3:o:qualcomm:qcn7606_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:qcn7606:-:*:*:*:*:*:*:*

No data.

No data.

Fixes

Solution

No solution given by the vendor.

Workaround

No workaround given by the vendor.

References

Link	Providers
https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin

History

No history.

MITRE

Status: PUBLISHED

Assigner: qualcomm

Published: 2023-08-08T09:15:03.741Z

Updated: 2024-08-02T13:43:23.590Z

Reserved: 2023-03-17T11:41:45.848Z

Link: CVE-2023-28561

Vulnrichment

Updated: 2024-07-11T21:06:12.933Z

NVD

Status : Modified

Published: 2023-08-08T10:15:14.447

Modified: 2024-11-21T07:55:29.340

Link: CVE-2023-28561

Redhat

No data.

OpenCVE Enrichment

No data.

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