CVE-2023-28561 - Vulnerability Details - OpenCVE

Description

Memory corruption in QESL while processing payload from external ESL device to firmware.

Published: 2023-08-08

Score: 9.8 Critical

EPSS: < 1% Very Low

KEV: No

Impact:

Action:

Analysis

No analysis available yet.

Default status is the baseline for the product, each version can override it (e.g. patched versions marked unaffected).

Vendor Product Default status Versions

Qualcomm, Inc.

Snapdragon

unaffected

Version	Status	Constraints
`QCN7606`	affected	—

Configuration 1 [-]

AND

cpe:2.3:o:qualcomm:qcn7606_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:qcn7606:-:*:*:*:*:*:*:*

No data.

No data available yet.

Remediation

No remediation available yet.

Tracking

Sign in to view the affected projects.

Advisories

Source	ID	Title
EUVD	EUVD-2023-32231	Memory corruption in QESL while processing payload from external ESL device to firmware.

No CVSS v4.0

Attack Vector Network

Attack Complexity Low

Privileges Required None

Scope Unchanged

Confidentiality Impact High

Integrity Impact High

Availability Impact High

User Interaction None

No CVSS v3.0

No CVSS v2

This CVE is not in the KEV list.

The EPSS score is 0.00188.

Exploitation none

Automatable no

Technical Impact total

References

Link	Providers
https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin

History

No history.

Subscriptions

Qualcomm Qcn7606 Qcn7606 Firmware

MITRE

Status: PUBLISHED

Assigner: qualcomm

Published: 2023-08-08T09:15:03.741Z

Updated: 2024-08-02T13:43:23.590Z

Reserved: 2023-03-17T11:41:45.848Z

Link: CVE-2023-28561

Vulnrichment

Updated: 2024-07-11T21:06:12.933Z

NVD

Status : Modified

Published: 2023-08-08T10:15:14.447

Modified: 2024-11-21T07:55:29.340

Link: CVE-2023-28561

Redhat

No data.

OpenCVE Enrichment

No data.

Weaknesses

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